Spring 2024 - Chemical Engineering 4420 " Special Topics Course"

 

 

Week 1 -  Students where introduced to the fundamentals of working in a cleanroom and reviewed machines that will be utilized during the course.

 

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Week 2 - Students began with an introduction to Ellipsometry and completed test scans followed by thin film thickness measurement

 

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Image 1 - Intro to Ellipsometry

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Image 2 - Thin Film Thickness Measurement

 






Week 3 -  Sample preparation began with resist spincoating, first layer exposure/alignment and microscopic inspection

 


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Image 1 - Microscopic Inspection

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Image 2 - Sample cleaning

 


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Image 3 - Sample Prep


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Image 4 -  Exposure/Alignment






Week 4 & 5 - Students prepped samples for the dopant layer application.  Next, students checked the alignment with previous markers etched in their wafers then applied the dopant layer. The organic layer of the dopant was removed by O2 Plasma then diffused into the silicon by Rapid Thermal Annealing.

 

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Image 1 - O2 Plasma Removal

 


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Image 2 - Dopant layer application

 

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Image 3 - Development

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Image 4 - Rapid Thermal Annealing






Week 6 -  Students etched the glass layer from their samples in preparation for application of the second layer

 


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Image 1 - HF Etching


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Image 2 - Microscopic Inspection





 

Week 7 -  This week students completed the second layer application and verified both layers.  The samples were prepped for the final layer

 

 

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Image 1 - Resist Spincoating

 

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Image 2 - Class Discussion

 

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Image 3 -  Second Layer Etch

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Image 4 - Microscopic Inspection

 

 






Week 8 & 9 - Students applied the final layer of their samples, deposited the final metal layer, confirmed an electrical current then measured the electrical properties by AFM

 

 

cImage 1 - Probe Station

cImage 2 - Ebeam Metal Layer Deposition

 

 

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Image 3 - AFM

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Image 4 - AFM Sample Prep






 

Week 10 -  Students completed the last step to device fabrication by collecting charge data from their newly fabricated devices.

 

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